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Choosing the correct PCB assembly process is important because this decision will directly affect the efficiency and cost of the manufacturing process as well as the quality and performance of the application.
PCB assembly is typically performed using one of two methods: surface mount technology or through-hole fabrication.
Surface mount technology is the most widely used PCB assembly. Through-hole manufacturing is less used, but still popular, especially in certain industries. The process by which you choose a PCB assembly process depends on many factors. To help you make the right choice, we prototype pcb assembly supplier have put together this short guide to choosing the right PCB assembly process.
Surface mount technology is the most commonly used PCB assembly process. It is used in many electronic products, from USB flash drives and smartphones to medical devices and portable navigation systems.
1, this PCB assembly process allows the manufacture of products of increasingly smaller sizes. If space is at a premium, then this is the best option for you if your design has components such as resistors and diodes.
2, Surface mount technology allows for a higher level of automation, which means that boards can be assembled at a faster rate. This allows you to handle PCBs in high volume and is more cost effective than through-hole component placement.
3. If you have unique requirements, surface mount technology may be highly customizable and therefore the right choice. If you need a custom designed PCB, then this process has the flexibility and power to deliver the desired results.
4. With surface mount technology, components can be secured to both sides of the board. This double-sided circuit board capability means you can apply more complex circuits without having to expand the application.
Although the use of through-hole manufacturing is becoming less and less common, it is still a common PCB assembly process.
PCB assemblies using through-hole fabrication are used for large components such as transformers, semiconductors and electrolytic capacitors and provide a stronger bond between the board and the application.
As a result, through-hole fabrication provides a higher level of durability and reliability. This additional security makes the process a preferred option for applications used in sectors such as the aerospace and military industries.
1, If your application must be subjected to high levels of stress (either mechanical or environmental) during operation, then the best choice for PCB assembly is through-hole fabrication.
2, If your application must operate at high speed and at the highest level under these conditions, then through-hole fabrication may be the right process for you.
3, If your application must operate at high and low temperatures, then the higher strength, durability and reliability of through-hole fabrication may be your best choice.
4, If it must operate under high pressure conditions and maintain its performance, through-hole fabrication may be the best PCB assembly process for your application.
In addition, due to constant innovation and growing demand for increasingly complex electronics, these electronics require increasingly complex, integrated and smaller PCBs, so your application may require two types of PCB assembly technology. This process is called "hybrid technology"
